Infrared Soldering Station BGA Tshuab Rau Laptop

Infrared soldering chaw nres tsheb BGA tshuab rau laptop

IR & cua kub cua rau hybrid-cua sov uas zoo dua rau lub loj (ntau tshaj 100 * 100mm) motherboard yog soldering, desoldering thiab preheated, dav siv nyob rau hauv factories, Lab thiab kho lub khw, thiab lwm yam.

1. Daim ntawv thov ntawm Infrared soldering chaw nres tsheb BGA tshuab rau laptop

Rau solder, reball, desolder ntau hom chips:

BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chips, thiab lwm yam.

2. Khoom nta ntawm Infrared soldering chaw nres tsheb BGA tshuab rau laptop

* ruaj khov thiab ntev lifespan (tsim rau 15 xyoo siv)

* tuaj yeem kho cov motherboard sib txawv nrog tus nqi ua tau zoo

* nruj me ntsis tswj cua sov thiab txias kub

* Optical alignment system: mounting kom raug hauv 0.01mm

* Yooj yim rau kev khiav lag luam. Leej twg tuaj yeem kawm siv nws hauv 30 feeb. Tsis xav tau kev txawj tshwj xeeb.

3. Specification ntawmInfrared soldering chaw nres tsheb BGA tshuab rau laptop

4. Cov ntsiab lus ntawmInfrared soldering chaw nres tsheb BGA tshuab rau laptop

1. Sab saum toj kub-cua thiab lub tshuab nqus tsev nqus tau teeb tsa ua ke, uas yooj yim khaws cov nti / cov khoom siv rauua ke.

2. Optical CCD nrog lub zeem muag sib cais rau cov dots ntawm lub nti vs motherboard duab ntawm lub vijtsam saib.

3. Lub vijtsam zaub rau lub nti (BGA, IC, POP thiab SMT, thiab lwm yam) vs nws cov motherboard sib phim cov dots dlhosua ntej soldering.

4. 3 cua sov zones, saum huab cua kub, qis cua kub thiab IR preheating zones, uas yuav siv tau rau me me rau iPhone motherboard, kuj, mus txog rau lub computer ann TV mainboards, thiab lwm yam.

5. IR preheating cheeb tsam them los ntawm steel-mesh, uas ua rau cov cua sov cov ntsiab lus sib npaug thiab nyab xeeb.

6. Kev sib txuas ua haujlwm rau lub sijhawm thiab qhov kub thiab txias, qhov kub thiab txias tuaj yeem khaws cia ntau li 50, 000 pawg.

5. Vim li cas thiaj xaiv peb qhov chaw nres tsheb Infrared soldering BGA tshuab rau lub laptop?

6. Daim ntawv pov thawj ntawm Infrared soldering chaw nres tsheb BGA tshuab rau lub laptop

UL, E-MARK, CCC, FCC, CE ROHS daim ntawv pov thawj. Lub caij no, txhawm rau txhim kho thiab ua kom zoo dua qub, Dinghua tau dhau ISO, GMP, FCCA, C-TPAT ntawm qhov chaw soj ntsuam daim ntawv pov thawj.

7. Ntim & Kev xa khoom ntawm Infrared soldering chaw nres tsheb BGA tshuab rau lub laptop

8. Kev xa khoom rau BGA rework chaw nres tsheb

DHL, TNT, FEDEX, SF, Kev thauj mus los hauv hiav txwv thiab lwm cov kab tshwj xeeb, thiab lwm yam .. Yog tias koj xav tau lwm lub sijhawm shipping, thov qhia rau peb.

Peb yuav txhawb koj.

9. Cov nqe lus them nqi

Hloov chaw hauv txhab nyiaj, Western Union, Credit Card.

Thov qhia rau peb yog tias koj xav tau lwm yam kev txhawb nqa.

10. Kev qhia ua haujlwm rau BGA rework chaw nres tsheb DH-A2

11. Cov kev paub txog rau aUtomatic reballing infrared BGA kho tshuab

                             Kev paub yooj yim ntawm BGA kho chaw nres tsheb

1.Lub hauv paus ntsiab lus ntawm kev kho cov cua kub SMD yog: siv cov cua kub zoo heev los sib sau ua ke ntawm cov pins thiab cov ntaub qhwv ntawm SMD kom yaj cov pob qij txha los yog rov ua cov khoom siv rov ua kom tiav qhov kev sib tsoo lossis vuam ua haujlwm. Lub tshuab nqus tsev twj tso kua mis nruab nrog lub caij nplooj ntoos hlav thiab cov roj hmab suction nozzle yog siv tib lub sij hawm rau disassembly. Thaum txhua qhov chaw vuam tau yaj, SMD cov cuab yeej tau maj mam nqus. Cov cua kub ntawm cov cua kub SMD kho qhov system tau paub los ntawm cov cua kub hloov pauv ntawm qhov sib txawv. Vim tias cov cua kub ntws tawm los ntawm qhov nruab nrab ntawm lub taub hau cua sov, nws yuav tsis ua rau SMD, lub substrate lossis cov khoom nyob ib puag ncig, thiab nws yooj yim rau disassemble lossis vuam SMD.

Qhov sib txawv ntawm kev kho tshuab los ntawm cov tuam txhab sib txawv feem ntau yog vim muaj qhov sib txawv ntawm cov cua kub sib txawv los yog cov cua kub sib txawv. Qee lub nozzles ua rau cov cua kub nyob ib puag ncig thiab hauv qab ntawm SMD ntaus ntawv, thiab qee lub nozzles tsuas yog txau cov cua kub saum SMD. Los ntawm qhov pom ntawm cov khoom siv tiv thaiv, nws yog qhov zoo dua los xaiv airflow nyob ib puag ncig thiab hauv qab ntawm SMD li. Txhawm rau tiv thaiv PCB warpage, nws yog ib qho tsim nyog yuav tsum xaiv qhov kho qhov system nrog lub preheating muaj nuj nqi nyob rau hauv qab ntawm PCB.

Txij li thaum cov pob qij txha ntawm BGA tsis pom nyob rau hauv qab ntawm lub cuab yeej, cov txheej txheem rov ua haujlwm yuav tsum tau nruab nrog lub teeb pom kev sib cais (lossis hauv qab qhov kev xav kho qhov muag) thaum rov vuam BGA, txhawm rau xyuas kom muaj kev sib raug zoo thaum txhim kho. BGA. Piv txwv li, Dinghua Technology, DH-A2, DH-A5 thiab DH-A6, thiab lwm yam.

2.BGA kho cov kauj ruam

Cov kauj ruam kho BGA yog qhov pib zoo ib yam li cov txheej txheem kho SMD ib txwm. Cov kauj ruam tshwj xeeb yog raws li nram no:

1. Tshem tawm BGA

(1) muab cov phaj sib dhos rau saum npoo kom disassembled rau ntawm lub rooj ua haujlwm ntawm qhov system rework.

(2) xaiv lub square kub cua nozzle sib piv qhov loj ntawm lub cuab yeej, thiab nruab cov cua kub nozzle ntawm tus pas nrig txuas ntawm lub tshuab cua sov. Them mloog mus rau qhov ruaj khov installation

(3) buckle cov cua kub nozzle ntawm lub cuab yeej, thiab xyuam xim rau qhov sib nrug deb ntawm lub cuab yeej. Yog tias muaj cov khoom nyob ib ncig ntawm lub cuab yeej uas cuam tshuam rau kev ua haujlwm ntawm lub tshuab cua kub, tshem cov khoom no ua ntej, thiab tom qab ntawd txuas lawv rov qab tom qab kho.

(4) xaiv lub khob nqus dej (nozzle) haum rau cov cuab yeej yuav tsum tau disassembled, kho qhov siab ntawm lub tshuab nqus tsev nqus cov twj tso kua mis ntawm lub tshuab nqus tsev nqus tsev vacuum, txo qis saum npoo ntawm lub khob nqus mus rau lub cuab yeej, thiab tig rau. lub tshuab nqus tsev twj hloov.

(5) Thaum teeb tsa qhov nkhaus qhov kub thiab txias, nws yuav tsum tau muab sau tseg tias qhov ntsuas kub disassembly yuav tsum tau teeb tsa raws li qhov loj ntawm lub cuab yeej, lub thickness ntawm PCB thiab lwm yam kev mob tshwj xeeb. Piv nrog rau cov tsoos SMD, qhov disassembly kub ntawm BGA yog hais txog 150 degree siab dua.

(6) tig lub zog cua sov thiab kho cov cua kub ntim.

(7) Thaum lub solder melts tag nrho, cov cuab yeej yog absorbed los ntawm lub tshuab nqus tsev pipette.

(8) nqa cov cua kub nozzle, kaw lub tshuab nqus tsev twj tso kua mis, thiab ntes cov cuab yeej disassembled.

2. Tshem tawm cov khoom seem ntawm PCB ncoo thiab ntxuav qhov chaw no

(1) Ntxuav thiab ua kom cov khoom seem ntawm PCB ncoo nrog cov hlau nplaum, thiab siv cov hlua khi uas tsis muaj hlua khi thiab lub tiaj tiaj tiaj zoo li lub taub hau taub hau los ntxuav. Ua tib zoo saib kom tsis txhob ua kom puas lub ncoo thiab lub ntsej muag lub ntsej muag thaum ua haujlwm.

(2) ntxuav cov flux residue nrog tshuaj ntxuav xws li isopropanol lossis ethanol.

3. Kev kho dehumidification

Vim tias PBGA rhiab heev rau cov dej noo, nws yog ib qho tsim nyog yuav tsum xyuas seb lub cuab yeej puas damped ua ntej sib dhos, thiab dehumidify lub damped ntaus ntawv.

(1) Txoj kev kho dehumidification thiab cov kev cai:

Tom qab unpacking, xyuas cov av noo daim card uas txuas rau lub pob. Thaum cov av noo qhia tau ntau tshaj 20 feem pua ​​(nyeem thaum nws yog 23 degree ± 5 degree), nws qhia tau hais tias lub cuab yeej tau damped, thiab lub cuab yeej yuav tsum dehumidified ua ntej mounting. Lub dehumidification tuaj yeem nqa tawm hauv qhov cub hluav taws xob kom qhuav thiab ci rau 12-20h ntawm 125 ± degree.

(2) Kev ceev faj rau dehumidification:

(a) cov cuab yeej yuav tsum tau muab tso rau hauv qhov kub-resistant (ntau dua 150 degree) antistatic yas tais rau ci.

(b) lub qhov cub yuav tsum tau zoo hauv av, thiab lub dab teg ntawm tus neeg teb xov tooj yuav tsum tau nruab nrog ib txoj hlua tiv thaiv zoo li qub nrog cov av zoo.

(1) Pulire e livellare la saldatura residua del pad PCB con saldatore e utilizzare la cinghia a treccia non saldata e la testa piatta del saldatore a forma di forcella per la pulizia. Prestare attenzione a non danneggiare il cuscinetto e la maschera di saldatura durante il funzionamento.

(2) pulire il residuo di flusso con un detergente tuaj isopropanolo o etanolo.

3. Trattamento di deumidificazione

Poiché PBGA è sensibile all'umidità, è necessario verificare se il dispositivo è smorzato prima del montaggio e deumidificare il dispositivo smorzato.

(1) Metodi e requisiti per il trattamento della deumidificazione:

Dopo il disimballaggio, controllare la scheda di visualizzazione dell'umidità allegata alla confezione. Quando l'umidità indicata è superiore al 20 feem pua ​​(leggere quando è di 23 degree ± 5 degree), indica che il dispositivo è stato smorzato e che il dispositivo deve essere deumidificato prima del montaggio. La deumidificazione può essere eseguita in un forno elettrico per asciugatura e cotta per 12-20 ore a 125 ± degree .

(2) Kev kho mob rau kev deumidificazione:

a) il dispositivo deve essere impilato nyob rau hauv un vassoio di plastica antistatica resistente alle alte kub (superiore ib 150 degree) ib la cottura.

(b) il forno deve essere ben collegato a terra e il polso dell'operatore deve essere dotato di un braccialetto antistatico con una buona messa a terra