BGA Kho Chaw Nres Tsheb

Tab sis yog tias koj nquag kho BGA chips uas tsis muaj lub vijtsam luam tawm, kuv xav kom xaiv qhov khoom siv kho qhov muag.

Yog li lwm cov qauv ntawm BGA rework chaw nres tsheb kho qhov muag pom kev pom qhov system, uas yog tus cwj pwm los ntawm kev saib xyuas tag nrho BGA chips, kom BGA chips yog qhov tseeb nrog lub motherboard.

BGA rework chaw nres tsheb muab faib ua optical alignment thiab non-optical alignment. Kev kho qhov muag kho qhov muag txais kev sib cais prism rau cov duab los ntawm cov khoom siv kho qhov muag; rau qhov tsis yog kho qhov muag kho qhov muag, BGA ua raws li qhov muag liab qab raws li cov kab ntawv luam tawm thiab cov ntsiab lus ntawm PCB pawg thawj coj saib kom ua tiav kev sib tw thiab kho.

Kev kho qhov muag kho qhov muagthiabnon-optical alignment

Kev kho qhov muag kho qhov muag - lub optical module txais kev sib cais prism imaging, LED teeb pom kev zoo, thiab kho cov teeb pom kev lag luam, kom cov nti me me yog duab thiab tso tawm ntawm cov zaub. Txhawm rau kom ua tiav qhov kev sib tw kho qhov muag rov ua haujlwm. Kev kho qhov muag tsis pom kev - BGA tau ua raws li qhov muag liab qab raws li cov kab ntawv luam tawm thiab cov ntsiab lus ntawm PCB pawg thawj coj saib kom ua tiav kev sib tw thiab kho. Cov cuab yeej ua haujlwm ntse rau kev pom kev sib dhos, vuam thiab disassembly ntawm BGA cov khoom qub ntawm ntau qhov sib txawv, txhim kho tus nqi kho thiab tsim tau zoo thiab txo cov nqi.

BGA: BGA pob nco

Lub I / O terminals ntawm BGA pob (Ball Grid Array Package) raug faib nyob rau hauv lub pob nyob rau hauv daim ntawv ntawm ncig los yog columnar solder pob qij txha nyob rau hauv ib tug array. Qhov zoo ntawm BGA thev naus laus zis yog tias txawm hais tias tus lej ntawm I / O tus pins nce, tus pin sib nrug tsis txo qis. Qhov me me tau nce, yog li txhim kho cov khoom sib dhos; Txawm hais tias nws lub zog siv tau nce ntxiv, BGA tuaj yeem ua los ntawm cov txheej txheem tswj kev sib tsoo, uas tuaj yeem txhim kho nws cov hluav taws xob thiab kev ua haujlwm thermal; lub thickness thiab hnyav yog txo piv nrog rau yav dhau los ntim tshuab. ; Cov kab mob parasites raug txo qis, lub teeb liab kis tau tus mob qeeb me me, thiab kev siv ntau zaus tau txhim kho zoo heev; Kev sib dhos tuaj yeem yog coplanar vuam, thiab kev ntseeg siab yog siab.

BGA ntim tshuab tuaj yeem muab faib uatsib qeb:

1. PBGA (Plasric BGA) substrate: feem ntau yog cov txheej txheem ntau txheej uas muaj 2-4 txheej ntawm cov khoom siv organic. Hauv Intel series CPU, Pentium II, III, IV processors txhua tus siv cov pob no.

2. CBGA (CeramicBGA) substrate: uas yog, ceramic substrate. Kev sib txuas hluav taws xob ntawm cov nti thiab cov substrate feem ntau yog siv txoj kev teeb tsa ntawm FlipChip (FC). Hauv Intel series CPU, Pentium I, II, thiab Pentium Pro processors tau siv tag nrho cov pob no.

3. FCBGA (FilpChipBGA) substrate: nyuaj multi-layer substrate.

4. TBGA (TapeBGA) substrate: Lub substrate yog ib tug strip-zoo li tus mos mos 1-2 txheej PCB Circuit Court board.

5. CDPBGA (Carity Down PBGA) substrate: yog hais txog lub nti cheeb tsam (tseem hu ua kab noj hniav cheeb tsam) nrog ib tug square qis kev nyuaj siab nyob rau hauv nruab nrab ntawm lub pob.

Lub npe tag nrho ntawm BGA yog Ball Grid Array (PCB nrog pob kab sib chaws array qauv), uas yog ib txoj hauv kev ntim khoom uas muaj kev sib koom ua ke siv lub rooj tsav xwm organic.

Nws muaj: ① txo pob cheeb tsam ② nce kev ua haujlwm, ntau tus pins ③ tuaj yeem ua tus kheej thaum lub rooj tsavxwm PCB yog soldered, yooj yim rau tinned ④ kev ntseeg siab ⑤ kev ua tau zoo hluav taws xob, tsis tshua muaj nqi thiab lwm yam. PCB boards nrog BGA feem ntau muaj ntau qhov me me. Feem ntau ntawm cov neeg siv khoom BGA ntawm lub qhov yog tsim los kom muaj lub qhov taub tiav ntawm 8 ~ 12 mil. Qhov kev ncua deb ntawm qhov chaw ntawm BGA thiab lub qhov yog 31.5 mil ua piv txwv, uas feem ntau tsis tsawg dua 10.5 mil. Lub qhov ntawm lub qhov nyob rau hauv BGA yuav tsum tau ntsaws, tus number case tsis tso cai rau ntawm BGA ncoo, thiab tsis pub drilling ntawm BGA ncoo

Muaj plaub hom BGA: PBGA, CBGA, CCGA thiab TBGA. Feem ntau, hauv qab ntawm pob yog txuas nrog lub pob array raws li I / O davhlau ya nyob twg. Cov pitches ib txwm ntawm cov pob arrays ntawm cov pob no yog 1.0mm, 1.27mm, thiab 1.5mm. Cov khoom siv lead-tin feem ntau ntawm cov khoom siv yog 63Sn / 37Pb thiab 90Pb / 10Sn. Txoj kab uas hla ntawm cov pob solder tsis sib haum rau qhov no. Cov qauv sib txawv ntawm lub tuam txhab mus rau lub tuam txhab.

Los ntawm qhov kev xav ntawm BGA sib dhos tshuab, BGA muaj cov yam ntxwv zoo dua li QFP cov khoom siv, uas yog qhov tseem ceeb hauv qhov tseeb tias BGA cov cuab yeej muaj cov kev cai nruj me ntsis rau qhov kev tso kawm raug. Nyob rau hauv txoj kev xav, thaum lub sij hawm soldering reflow txheej txheem, txawm yog hais tias lub solder balls yog feem ntau npaum li 50 feem pua ​​ntawm cov pawm yog offset, lub ntaus ntawv txoj hauj lwm kuj yuav raug kho vim qhov nro ntawm lub solder, uas tau sim ua pov thawj rau. yuav pom tseeb heev. Qhov thib ob, BGA tsis muaj teeb meem ntawm tus pin deformation ntawm cov cuab yeej xws li QFP, thiab BGA kuj muaj kev sib koom ua ke zoo dua li QFP thiab lwm yam khoom siv, thiab nws qhov sib txawv ntawm cov hlau lead yog ntau dua li ntawm QFP, uas tuaj yeem txo qhov vuam Paste luam ntawv tsis xws luag. ua rau solder sib koom "bridging" teeb meem; Tsis tas li ntawd, BGAs muaj hluav taws xob zoo thiab thermal zog, nrog rau kev sib txuas siab ceev. Qhov tsis zoo ntawm BGA yog qhov nyuaj rau kev kuaj xyuas thiab kho cov pob qij txha, thiab kev ntseeg siab ntawm cov pob qij txha yog qhov nruj, uas txwv tsis pub siv BGA cov khoom siv hauv ntau qhov chaw.