BGA Cov

Nrog rau kev nce qib ntawm kev sib koom ua ke thev naus laus zis, kev txhim kho ntawm cov cuab yeej siv, thiab kev siv cov cuab yeej sib sib zog nqus submicron, LSI, VLSI, thiab ULSI tau tshwm sim ib zaug. Kev sib xyaw ua ke ntawm silicon ib qho chips txuas ntxiv mus, thiab cov kev cai rau kev ntim khoom sib xyaw ua ke tau nruj dua. Nrog ib tug ntse nce, lub hwj chim noj kuj nce. Txhawm rau ua kom tau raws li qhov xav tau ntawm txoj kev loj hlob, raws li lub hauv paus ntawm cov khoom ntim thawj, muaj ntau yam tshiab tau ntxiv - pob kab sib chaws array ntim, hu ua BGA (Ball Grid Array Package).

Lub cim xeeb ntim nrog BGA thev naus laus zis tuaj yeem ua kom lub cim xeeb muaj peev xwm los ntawm ob mus rau peb zaug thaum tuav tib lub ntim. Piv nrog TSOP, BGA muaj qhov ntim me me, kev ua kom sov zoo dua thiab kev ua haujlwm hluav taws xob. BGA ntim tshuab tau zoo heev txhim kho lub peev xwm cia ib square inch. Raws li tib lub peev xwm, qhov ntim ntawm cov khoom siv nco siv BGA ntim tshuab tsuas yog ib feem peb ntawm cov khoom ntim TSOP; Tsis tas li ntawd, piv nrog cov qauv TSOP ntim cov txheej txheem, BGA ntim Nws muaj txoj hauv kev sai dua thiab zoo dua rau cov cua sov dissipate.

Lub I / O terminals ntawm BGA pob tau muab faib rau hauv pob hauv daim ntawv ntawm cov voj voog lossis cov kab sib txuas ntawm cov pob qij txha hauv ib qho array. Qhov kom zoo dua ntawm BGA thev naus laus zis yog tias txawm hais tias tus naj npawb ntawm I / O pins tau nce, qhov sib nrug ntawm tus pin tsis tau txo qis tab sis nce ntxiv, yog li Cov khoom sib dhos tau zoo tuaj; Txawm hais tias nws qhov kev siv hluav taws xob nce ntxiv, BGA tuaj yeem welded nrog kev tswj kev sib tsoo nti, uas tuaj yeem txhim kho nws cov kev ua haujlwm electrothermal; thickness thiab hnyav yog txo piv nrog rau yav dhau los ntim technologies; parasitic tsis (loj tam sim no Thaum lub amplitude hloov, qhov tso zis voltage cuam tshuam) txo, lub teeb liab kis tau tus mob ncua me me, thiab qhov zaus ntawm kev siv yog heev nce; Kev sib dhos tuaj yeem yog coplanar vuam, thiab kev ntseeg siab yog siab.

Sai li BGA tshwm sim, nws tau los ua qhov kev xaiv zoo tshaj plaws rau kev ua haujlwm siab, kev ua haujlwm siab, kev ua haujlwm ntau thiab siab I / O pin ntim ntawm VLSI chips xws li CPUs thiab North-South Bridges. Nws cov yam ntxwv yog:

1. Txawm hais tias tus naj npawb ntawm I / O pins tau nce, qhov sib nrug ntawm tus pin yog ntau dua li ntawm QFP, uas txhim kho cov khoom sib dhos;

2. Txawm hais tias nws qhov kev siv hluav taws xob nce ntxiv, BGA tuaj yeem raug kho los ntawm kev tswj lub cev qhuav dej, hu ua C4 soldering, uas tuaj yeem txhim kho nws cov kev ua haujlwm electrothermal;

3. Lub thickness yog txo los ntawm ntau tshaj 1/2 tshaj li ntawm QFP, thiab qhov hnyav yog txo los ntawm ntau tshaj 3/4;

4. Cov kab mob parasitic txo qis, lub teeb liab kis tau tus mob qeeb me me, thiab qhov kev siv ntau zaus ntau ntxiv;

5. Coplanar vuam siv tau rau kev sib dhos, muaj kev ntseeg siab;

6. BGA ntim tseem zoo ib yam li QFP thiab PGA, tuav ntau qhov chaw substrate;

Tsis tas li ntawd, rau hom BGA rework no, uas yuav yooj yim dua thiab:

1. PBGA (Plastic BGA) substrate: feem ntau yog cov txheej txheem ntau txheej uas muaj 2-4 txheej ntawm cov khoom siv organic. Ntawm Intel series CPUs, Pentium II, III, thiab IV processors txhua tus siv cov pob no. Hauv ob xyoos dhau los, lwm daim ntawv tau tshwm sim: uas yog, IC tau ncaj qha mus rau lub rooj tsavxwm. Nws tus nqi yog pheej yig dua li tus nqi ib txwm muaj, thiab nws feem ntau yog siv hauv kev ua si thiab lwm yam kev lag luam uas tsis muaj cov kev cai nruj heev.

2. CBGA (CeramicBGA) substrate: uas yog, ceramic substrate. Kev sib txuas hluav taws xob ntawm cov nti thiab cov substrate feem ntau yog ntsia los ntawm flip nti (FlipChip, FC luv luv). Ntawm Intel series CPUs, Pentium I, II, thiab Pentium Pro processors tau siv tag nrho cov pob no.

3. FCBGA (FilpChipBGA) substrate: nyuaj multi-layer substrate.

4. TBGA (TapeBGA) substrate: Lub substrate yog ib tug strip-zoo li tus mos mos 1-2 txheej PCB Circuit Court board.

5. CDPBGA (Carity Down PBGA) substrate: yog hais txog lub nti cheeb tsam (tseem hu ua kab noj hniav cheeb tsam) nrog ib tug square depression nyob rau hauv nruab nrab ntawm lub pob.

BGA pab

1. Ntim txheej txheem ntws ntawm hlau sib txuas PBGA

① Kev npaj ntawm PBGA substrate

Laminate very thin (12~18μm thick) copper foil on both sides of the BT resin/glass core board, and then perform drilling and through-hole metallization. Use conventional PCB processing technology to make graphics on both sides of the substrate, such as conduction bands, electrodes, and land arrays for installing solder balls. A solder mask is then added and patterned to expose the electrodes and pads. In order to improve production efficiency, a substrate usually contains multiple PBG substrates.

② Cov txheej txheem ntim khoom

Wafer thinning → wafer txiav → tuag bonding → plasma tu → xaim tsev → plasma tu → molding ntim → sib sau cov pob → reflow soldering → nto marking → kev sib cais → kev soj ntsuam zaum kawg → ntim ntim

Yog tias kuaj tsis zoo, nti yuav tsum tau muab tshem tawm / tshem tawm, yog li lub tshuab ua haujlwm yuav tsum tau ua raws li hauv qab no: