BGA Soldering

Lub substrate los yog nruab nrab txheej yog ib qho tseem ceeb heev ntawm BGA pob. Ntxiv nrog rau kev siv rau kev sib txuas sib txuas, nws tseem tuaj yeem siv rau kev tswj hwm impedance thiab kev koom ua ke ntawm inductors / resistors / capacitors. Yog li ntawd, cov khoom siv substrate yuav tsum muaj qhov kub hloov pauv iav rS (kwv yees li 175 ~ 230 degree), siab ruaj khov thiab tsis muaj dej noo, nrog rau kev ua haujlwm zoo hluav taws xob thiab kev ntseeg siab. Kuj tseem muaj qhov xav tau rau siab adhesion ntawm cov yeeb yaj kiab hlau, txheej txheej insulating thiab substrate nruab nrab.

FC-CBGA ntim txheej txheem ntws

① Ceramic substrate

Lub substrate ntawm FC-CBGA yog ib tug multilayer ceramic substrate, thiab nws cov ntau lawm yog heev nyuaj. Vim hais tias qhov sib txuas ntawm lub substrate yog siab, qhov sib nrug yog nqaim, muaj ntau qhov los ntawm qhov, thiab cov kev cai coplanarity ntawm lub substrate yog siab. Nws cov txheej txheem tseem ceeb yog: thawj zaug sib koom ua ke ntawm cov ntawv sib txuas ntawm cov khoom siv hluav taws xob ntawm qhov kub siab rau hauv cov txheej txheem ceramic metallized substrate, tom qab ntawd ua cov kab hlau sib txuas ntawm cov substrate, thiab tom qab ntawd ua electroplating thiab lwm yam. Hauv kev sib dhos ntawm CBGA, CTE mismatch ntawm substrate, nti thiab PCB pawg thawj coj saib yog qhov tseem ceeb ua rau tsis ua haujlwm ntawm CBGA cov khoom. Txhawm rau txhim kho qhov teeb meem no, ntxiv rau CCGA qauv, lwm yam ceramic substrate - HITCE ceramic substrate kuj siv tau.

② Cov txheej txheem ntim khoom

Wafer bump preparation->wafer cutting->chip flip-chip and reflow soldering->underfill thermal grease, sealing solder distribution->capping->assembly solder balls->reflow soldering->marking->separation -> Final Inspection -> Testing ->Ntim

Kev ntim cov txheej txheem ntws ntawm cov hlau nplaum TBGA

① TBGA daim kab xev

Cov cab kuj ntawm TBGA feem ntau yog ua los ntawm cov khoom siv polyimide.

Thaum lub sij hawm tsim khoom, tooj liab cladding yog thawj zaug ntawm ob sab ntawm cov cab kuj daim kab xev, ces npib tsib xee thiab kub plating, thiab tom qab ntawd los ntawm-qhov thiab los ntawm-lub qhov metallization thiab graphics yog tsim. Vim hais tias nyob rau hauv no hlau-bonded TBGA, lub pob kub dab dej yog lub zog ntawm lub pob thiab cov tub ntxhais kab noj hniav hauv paus ntawm lub pob, yog li cov cab kuj yuav tsum tau khi rau lub dab dej kub nrog lub siab-rhiab nplaum nplaum ua ntej ntim.

② Cov txheej txheem ntim khoom

Wafer thinning → wafer txiav → tuag bonding → tu → xaim bonding → plasma tu → kua sealant potting → sib sau cov pob → reflow soldering → nto marking → kev sib cais → xeem → kuaj → ntim

Yog tias qhov ntsuas tsis zoo, nti yuav tsum tau desoldered, reballed, mounted thiab soldered, thiab ib tug kws rework

chaw nres tsheb tseem ceeb rau cov txheej txheem ntawd:

TinyBGA pob nco

Thaum nws los txog rau BGA ntim, peb yuav tsum hais Kingmax's patented TinyBGA thev naus laus zis. TinyBGA hu ua Tiny Ball Grid Array (me me pob kab sib chaws array pob) ua lus Askiv, uas yog ib ceg ntawm BGA ntim tshuab. Nws tau ua tiav tiav los ntawm Kingmax thaum Lub Yim Hli 1998. Qhov piv ntawm thaj chaw nti rau thaj tsam pob tsis tsawg dua 1: 1.14, uas tuaj yeem ua kom lub cim xeeb muaj peev xwm nce 2 mus rau 3 zaug thaum lub ntim ntawm lub cim xeeb tseem zoo ib yam. Piv nrog TSOP cov khoom ntim khoom, uas muaj cov ntim me me, kev ua kom sov zoo dua thiab kev ua haujlwm hluav taws xob. Cov khoom siv nco siv TinyBGA ntim tshuab tsuas yog 1/3 ntawm qhov ntim ntawm TSOP ntim raws li tib lub peev xwm. Cov pins ntawm TSOP pob lub cim xeeb yog kos los ntawm qhov nruab nrab ntawm lub nti, thaum lub pins ntawm TinyBGA tau kos los ntawm qhov nruab nrab ntawm lub nti. Txoj kev no ua tau zoo txo ​​qhov kev ncua deb ntawm lub teeb liab, thiab qhov ntev ntawm lub teeb liab kis tau tus mob tsuas yog 1/4 ntawm cov tsoos TSOP technology, yog li ntawd lub attenuation ntawm lub teeb liab kuj txo. Qhov no tsis tsuas yog txhim kho kev tiv thaiv kev cuam tshuam thiab kev ua haujlwm ntawm lub suab nrov ntawm lub nti, tab sis kuj tseem txhim kho kev ua haujlwm ntawm hluav taws xob.

Me me BGA pob

Lub thickness ntawm TinyBGA ntim nco kuj yog thinner (lub pob qhov siab yog tsawg dua {{0}}}.8mm), thiab cov cua kub dissipation txoj kev los ntawm cov hlau substrate mus rau lub radiator tsuas yog 0.36mm. Yog li ntawd, TinyBGA nco muaj kev ua haujlwm zoo dua cov cua sov thiab yog qhov tsim nyog rau kev ua haujlwm ntev nrog kev ruaj ntseg zoo.

Qhov txawv ntawm BGA pob thiab TSOP pob

Lub cim xeeb ntim nrog BGA thev naus laus zis tuaj yeem ua kom lub cim xeeb muaj peev xwm los ntawm ob mus rau peb zaug thaum tuav tib lub ntim. Piv nrog TSOP, BGA muaj qhov ntim me me, kev ua kom sov zoo dua thiab kev ua haujlwm hluav taws xob. BGA ntim tshuab tau zoo heev txhim kho lub peev xwm cia ib square inch. Raws li tib lub peev xwm, qhov ntim ntawm cov khoom siv nco siv BGA ntim tshuab tsuas yog ib feem peb ntawm cov khoom ntim TSOP; piv nrog TSOP ntim, BGA ntim muaj qhov zoo. Txoj kev nrawm dua thiab ua tau zoo dua rau dissipate tshav kub.

Txawm nws yog BGA lossis TSOP, uas tuaj yeem kho tau los ntawm BGA rework tshuab: