BGA Rework Profiles
1.Teem kub profiles ntau npaum li koj xav tau
2.Easy alignment system
3. Tsis siv neeg tuaj tos lossis hloov rov qab
4.Double-lub teeb thiab 3 cua sov cheeb tsam
Hauj lwm lawm
BGA rework yuav tsum tau teem lub ntsuas kub raws li qhov sib txawv solder paste curves, yog li ntawd qhov kub thiab txias ntawm lub ncoo yog nyob ze rau ntawm solder paste nkhaus. Feem ntau, cov txheej txheem ntau qhov kub ntawm qhov chaw cua sov qhia nyob rau hauv (Daim duab 1) tau txais, thiab qhov ntsuas kub nkhaus tau muab faib ua thaj chaw ua ntej, thaj chaw ua haujlwm, thaj chaw rov qab, thiab thaj chaw txias.
Daim duab 1
1. preheating cheeb tsam
Preheating theem (Preheating theem), kuj hu ua qhov chaw nqes hav, nce qhov kub ntawm qhov kub thiab txias mus rau qhov kub thiab txias ua kom sov, rhuav tshem cov hlau oxide zaj duab xis thiab ntxuav qhov saum npoo ntawm cov hmoov hlau solder, uas yog qhov tsim nyog rau infiltration ntawm solder thiab. tsim ntawm solder joint alloy. Qhov kub nce siab nyob rau hauv cheeb tsam no yuav tsum tau tswj nyob rau hauv ib qho chaw tsim nyog. Yog tias nws ceev heev, thermal shock yuav tshwm sim, thiab cov substrate thiab cov khoom siv yuav puas; Yog tias nws qeeb dhau lawm, yuav tsis muaj sijhawm txaus rau PCB kom ncav cuag qhov kub thiab txias, ua rau cov kuab tshuaj tsis txaus volatilization. , cuam tshuam rau vuam zoo. Feem ntau, qhov kub siab tshaj plaws tau teev tseg yog 4 degree / sec, thiab qhov ntsuas kub feem ntau yog 1 txog 3 degree / sec.
2. thaj chaw ua haujlwm
Qhov chaw nquag (soak theem), qee zaum hu ua thaj chaw khaws cia cua sov, hais txog cov txheej txheem uas qhov kub nce ntawm 140 degree mus rau 170 degree. Lub hom phiaj tseem ceeb yog ua kom qhov kub thiab txias ntawm PCB Cheebtsam yuav zoo ib yam thiab txo qhov kub ntawm qhov sib txawv; kom tso cai rau kev ua kom cov flux, lub ncoo, tshem tawm Oxide ntawm cov khoom siv thiab cov khoom siv lead ua. Qhov chaw no feem ntau suav rau 33 ~ 50 feem pua ntawm cov cua sov channel, thiab theem no yuav siv sij hawm 40 ~ 120s.
3. reflow cheeb tsam
Lub hom phiaj tseem ceeb ntawm cov theem reflow yog los tiv thaiv cov solder lossis hlau los ntawm kev txuas ntxiv mus rau oxidize, ua kom cov kua dej ntawm cov solder, ntxiv txhim kho lub peev xwm wetting ntawm lub solder thiab lub ncoo, thiab nce qhov kub ntawm PCB los ua ke los ntawm qhov kub thiab txias. mus rau qhov pom zoo siab tshaj tus nqi kub. Lub reflux ntawm theem no yuav tsum tsis txhob ntev dhau, feem ntau yog 30-60s ntawm qhov kub thiab txias. Qhov ntsuas kub nce mus txog 3 degree / sec, qhov kub siab tshaj plaws feem ntau yog 205-230 degree , thiab lub sijhawm mus txog qhov siab tshaj yog 10-20s. Lub melting point kub ntawm cov solders sib txawv yog txawv, xws li 63Sn37Pb yog 183 degree C, thiab 62Sn / 36Pb / 2Ag yog 179 degree C, yog li qhov kev ua tau zoo ntawm solder paste yuav tsum raug coj mus rau hauv tus account thaum teeb tsa tsis. Qhov ua kom kub yog ib txwm me ntsis qis dua qhov kub ntawm qhov kub ntawm cov hlau, thiab qhov kub siab tshaj plaws yog ib txwm nyob ntawm qhov melting point.
4. qhov chaw txias
Txias theem (txias theem), cov tin-ua hmoov hmoov nyob rau hauv seem no ntawm lub solder muab tshuaj txhuam tau melted thiab tag nrho wetted nto yuav tsum tau kev cob cog rua, nws yuav tsum tau txias kom sai li sai tau, uas yuav pab tau kom tau ib tug kaj solder pob qij txha, thiab muaj. zoo kev ncaj ncees thiab tsis tshua muaj kev sib cuag lub kaum sab xis. Txawm li cas los xij, qhov txias txias heev yuav ua rau kub siab dhau ntawm cov khoom siv thiab cov khoom siv substrate, ua rau lub thermal expansion mismatch, ua rau kev sib cais ntawm cov sib koom tes thiab cov ntaub qhwv thiab deformation ntawm lub substrate. Feem ntau, qhov siab tshaj plaws tso cai txias yog txiav txim siab los ntawm cov ntsiab lus teb rau cov cua sov. Nyob ntawm kev poob siab. Raws li cov ntsiab lus saum toj no, qhov ntsuas cua txias hauv thaj chaw txias yog feem ntau nyob ib puag ncig 4 degree / sec.
Qhov nkhaus qhia hauv daim duab 1 yog siv dav heev thiab tuaj yeem hu ua cua sov-tuav hom nkhaus. Cov tshuaj nplaum nplaum tau nce nrawm nrawm los ntawm qhov kub thiab txias mus rau qhov kub ntawm qhov kub ntawm qhov ntau ntawm 140-170 degree , thiab tuav nws li ntawm 40-120s raws li kev txuag hluav taws xob. cheeb tsam, tom qab ntawd kub sai sai mus rau thaj tsam reflow, thiab thaum kawg txias sai sai thiab nkag mus rau hauv qhov chaw txias kom ua tiav cov soldering.
Lub reflow profile yog tus yuam sij los xyuas kom meej qhov zoo ntawm BGA soldering. Ua ntej txiav txim siab qhov nkhaus reflow, nws yuav tsum tau qhia meej: solder paste nrog cov ntsiab lus hlau sib txawv muaj qhov sib txawv ntawm qhov kub thiab txias. Ua ntej, nws yuav tsum tau teeb tsa raws li qhov ntsuas kub tau pom zoo los ntawm cov chaw tsim khoom siv tshuaj pleev xim, vim tias cov hlau nplaum hauv cov tshuaj txhuam hniav txiav txim siab qhov melting point, thiab cov flux txiav txim siab qhov kub thiab txias. Ua kom kub. Tsis tas li ntawd, cov ntaub nplaum nplaum yuav tsum tau hloov kho hauv zos raws li cov khoom siv, tuab, cov txheej txheem, thiab qhov loj ntawm PCB.
Kev tswj qhov kub thiab txias ntawm BGA rework chaw nres tsheb yuav tsum xyuas kom meej tias cov khoom yuav tsum tau rov ua dua, cov khoom nyob ib puag ncig lossis cov khoom siv, thiab PCB cov ntaub qhwv tsis tuaj yeem puas thaum lub sij hawm disassembly thiab soldering. Reflow soldering cua sov txoj kev feem ntau muab faib ua ob hom: cua kub cua sov thiab infrared cua sov. Cov cua kub cua sov yog sib xws nyob rau hauv ib cheeb tsam me me, thiab yuav muaj ib qho chaw txias txias hauv ib cheeb tsam loj; Thaum cov cua sov infrared tsis sib xws hauv thaj chaw loj, qhov tsis zoo yog vim qhov tob ntawm cov xim ntawm cov khoom, qhov nqus tau thiab cov cua sov tsis sib xws. Vim muaj qhov txwv ntim ntawm BGA rework chaw ua haujlwm, nws qhov ntsuas kub yuav tsum tau txais kev tsim tshwj xeeb.
