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Los ntawm txhais tes Optical BGA Soldering Tshuab

phau ntawv kho qhov muag bga soldering tshuab 1. Ceev saib ua ntej: DH-G600 BGA soldering chaw nres tsheb yog dav siv nyob rau hauv Chip Level Kho nyob rau hauv laptop, PS3, PS4, XBOX360, Moblie Xov tooj, thiab lwm yam. Eqiupped nrog laser positioning muaj nuj nqi, DH-G600 bga rework chaw nres tsheb tuaj yeem ceev txoj haujlwm ntawm BGA Chip thiab motherboard. 2....

Hauj lwm lawm

phau ntawv kho qhov muag bga soldering tshuab

1. Ceev saib ua ntej:

DH-G600 BGA soldering chaw nres tsheb yog dav siv nyob rau hauv Chip Level Kho nyob rau hauv lub laptop, PS3, PS4, XBOX360, Moblie Xov tooj, thiab lwm yam.

Eqiupped nrog laser positioning muaj nuj nqi, DH-G600 bga rework chaw nres tsheb tuaj yeem ceev txoj hauj lwm ntawm BGA Chip thiab motherboard.

 

Khoom parameter

 

Khoom npe

soldering thiab desolding tshuab

Tag nrho lub zog

5300W

cua sov sab saum toj

1200w

cua sov hauv qab

Hauv qab cua kub cua sov 1200W, IR preheating 2700W

Hwj chim

220V 50HZ / 60HZ Cov

Qhov chaw

V-groove, PCB boards tuaj yeem hloov kho hauv X, Y axis thiab nruab nrog universal fixture

Kev tswj qhov kub thiab txias

K-hom, kaw lub voj

PCB loj

Max 400x380mm, Min 22x22mm

Chip loj

2 x 2-50 x 50 mm

Yam tsawg kawg ntawm nti sib nrug

0.15 hli

Sab nraud kub sensor

1 (yeem)

N.W.

cav 60kg

Tsim nyog motherboards

mobile xov tooj, laptop, desktop, game console, XBOX360, PS3

 

2. Khoom piav qhia ntawm DH-G600 BGA rework chaw nres tsheb

Yam ntxwv:

1. Tseeb Tshiab Optical Alignment System, yooj yim rau kev khiav lag luam, kev vam meej yuav ua tau 100%.

2. Nrog laser txoj hauj lwm.

3. Tsis siv neeg txheeb xyuas BGA chips thiab mounting qhov siab.

4. Sab saum toj cua sov ntaus ntawv thiab mounting taub hau 2 nyob rau hauv 1 tsim.

5. Semi amtomatic soldering thiab desoldering.

6. CCD System thiab Optical Alignment System ua ke, tuaj yeem hloov lub vijtsam los ntawm ib lub pob.

7. Tsis siv neeg kho chromatism daws teeb meem thiab ci ntsa iab.

8. Nrog laser txoj hauj lwm.

9. Nrog Micrometer ua Micro kho.

10. Nrog rau cov kiv cua uas muaj zog cross-flow kom txias PCB sai kom tsis txhob deformation.

11. Nrog 3 temprature zones thiab ib qho kev xaiv temp sensor sockets.

 

3. Kho cov kauj ruam:

1

Cais lub BGA nti ntawm niam board -peb hu ua desoldering

2

Ntxuav Pad

3

Reballing lossis hloov BGA nti tshiab ncaj qha

4

Alignment / Positioning - Nyob ntawm qhov kev paub, kab xev, lub koob yees duab kho qhov muag

5

Hloov BGA nti tshiab - peb hu ua Soldering

4.Cov duab nthuav dav ntawm G600 BGA REWORK STATION

 

G600 bga rework station features 1.jpg

G600 bga rework station features 2.jpg

G600 bga rework station features 3.jpg

 

 

5.Tuam txhab Profile

Qee cov duab ntawm peb lub Hoobkas thiab BGA rework chaw nres tsheb

Chaw ua haujlwm

 

office.jpg

 

Mkev tsim cov kab

 

G600 bga rework station  manufacturing lines.jpg

 

CE Certification raws li hauv qab no

 

CE.jpg

 

Ib feem ntawm peb Cov Neeg Siv Khoom

 

hornored clients.jpg

 

6. Ntim & Xa & Kev Pabcuam ntawm G600 BGA REWORK STATION

 

 

G600 bga rework station  pack.jpg

delivery.jpg

 

 

7.Kev paub txog

Plaub txoj kev cog pob

Feem ntau muaj plaub txoj hauv kev rau kev thov BGA pob-spling, uas yog txoj hauv kev siv cov cuab yeej nkaus xwb, txoj kev siv cov qauv, kev tuav phau ntawv thiab txhuam cov khoom siv kom zoo.

8.1 Pob planter method

Yog hais tias muaj ib lub pob-gripper xaiv ib tug template txuam BGA ncoo, qhov qhib qhov loj ntawm lub template yuav tsum yog 0.05--0.1 hli loj dua lub cheeb ntawm lub solder pob. Tshaj tawm lub pob solder sib npaug ntawm tus qauv, co lub pob-cov kabmob, thiab muab cov khoom siv ntau dhau. Lub pob yog dov los ntawm lub template mus rau lub solder ball collection groove ntawm lub pob planter li ntawd

tsuas yog ib lub pob solder yog khaws cia nyob rau hauv txhua lub qhov dej ntawm lub template nto

8.2 Siv Txoj Kev Template

Muab cov ntawv luam tawm los yog muab tshuaj txhuam BGA rau ntawm lub rooj zaum ua haujlwm nrog cov flux lossis cov tshuaj txhuam hniav tig ntsej muag. Npaj BGA pad-match template. Qhov qhib ntawm lub template yuav tsum yog 0.05-0.1 mm loj dua li txoj kab uas hla ntawm lub pob solder. Muab nws tus qauv nyob ib ncig ntawm lub ncoo thiab muab tso rau ntawm cov ntawv luam tawm BGA ntawm cov flux lossis solder paste. Qhov kev ncua deb ntawm BGAs yog sib npaug los yog me ntsis tsawg tshaj li lub cheeb ntawm cov pob solder, raws li nyob rau hauv lub microscope. Tshaj tawm lub pob solder sib npaug ntawm cov stencil, thiab siv cov tweezers kom tshem tawm cov pob ntau dhau kom tsuas yog ib lub pob solder nyob rau hauv txhua qhov xau ntawm qhov chaw stencil. Tshem cov template, xyuas nws thiab ua kom tiav.

8.3 Tes Mounting

Muab cov ntawv luam tawm los yog muab tshuaj txhuam BGA rau ntawm lub rooj zaum ua haujlwm nrog cov flux lossis cov tshuaj txhuam hniav tig ntsej muag. Muab cov khoom siv ib qho los ntawm ib qho nrog ib lub tweezers los yog ib lub stylus zoo li ib thaj.

8.4 Txhuam kom zoo npaum li cas solder paste txoj kev

Thaum ua cov qauv, lub thickness ntawm lub template yog thickened, thiab qhib qhov loj ntawm lub template yog me ntsis loj, thiab solder paste yog ncaj qha luam tawm ntawm lub ncoo ntawm BGA. Vim yog qhov nro saum npoo, cov khoom siv solder yog tsim tom qab reflow.Lub pob-cog txoj kev yog siv nyob rau hauv tsab xov xwm no. Cov hauv qab no piav qhia txog lub pob-cog txoj kev ntawm pob-planter.

 

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