IR Preheating BGA IC Chips Tshem Tawm Tshuab
1. Upper/bottom kub-cua rau soldering los yog desoldering.2. Saib xyuas lub vijtsam 15" 1080P.3. Tsis siv neeg lub tswb 5 ~ 10s ua ntej nws desoldering yuav dhau 4. Sib nqus nozzles uas yooj yim rau nruab lossis tshem tawm
Hauj lwm lawm
Kev qhia ua haujlwm rau BGA rework chaw nres tsheb DH-A2
DH-A2 yog tus qauv tsim nyog ntawm cov tshuab no nrog kho qhov muag sib dhos, txiav solder, desolder, tuaj tos thiab hloov.
Universal fixtures yog siv rau txhua yam ntawm PCBAs, laser taw tes yuav pab tau sai sai muab lub PCB ntawm ib tug zoo txoj hauj lwm, lub movable workbench yog yooj yim rau ib tug PCB sab laug los yog sab xis.
1. Daim ntawv thov ntawm IR preheating BGA IC chips tshem tawm tshuab
Rau solder, reball, desolder ntau hom chips:
BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, LED chips, thiab lwm yam.
2. Khoom Nta ntawm IR preheating BGA IC chips tshem tawm tshuab
* ruaj khov thiab ntev lifespan (tsim rau 15 xyoo siv)
* tuaj yeem kho cov motherboard sib txawv nrog tus nqi ua tau zoo
* nruj me ntsis tswj cua sov thiab txias kub
* Optical alignment system: mounting kom raug hauv 0.01mm
* Yooj yim rau kev khiav lag luam. Leej twg tuaj yeem kawm siv nws hauv 30 feeb. Tsis xav tau kev txawj tshwj xeeb.
3. Specification ntawmIR preheating BGA IC chips tshem tawm tshuab
| Fais fab mov | 110 ~ 240V 50/60Hz |
| Tus nqi zog | 5400W |
| Auto qib | solder, desolder, khaws thiab hloov, thiab lwm yam. |
| Optical CCD | tsis siv neeg nrog lub chip feeder |
| Khiav tswj | PLC (Mitsubishi) |
| nti sib nrug | 0.15 hli |
| Touchscreen | nkhaus tshwm, lub sij hawm thiab qhov kub thiab txias |
| PCBA loj muaj | 22 * 22 ~ 400 * 420mm |
| chip loj | 1 * 1 ~ 80 * 80mm |
| Qhov hnyav | ib 74kg |
4. Cov ntsiab lus ntawmIR preheating BGA IC chips tshem tawm tshuab
1. Sab saum toj kub-cua thiab lub tshuab nqus tsev nqus tau teeb tsa ua ke, uas yooj yim khaws cov nti / cov khoom sib xyaw kom haum.
2. Optical CCD nrog lub zeem muag sib cais rau cov dots ntawm lub nti vs motherboard duab ntawm lub vijtsam saib.
3. Lub vijtsam zaub rau ib lub nti (BGA, IC, POP thiab SMT, thiab lwm yam) vs nws cov motherboard sib phim cov dots ua ntej soldering.
4. 3 cua sov zones, saum huab cua kub, qis cua kub thiab IR preheating zones, uas yuav siv tau rau me me rau iPhone motherboard, kuj, mus txog rau lub computer ann TV mainboards, thiab lwm yam.
5. IR preheating cheeb tsam them los ntawm steel-mesh, uas ua rau cov cua sov cov ntsiab lus sib npaug thiab nyab xeeb.
6. Kev sib txuas ua haujlwm rau lub sijhawm thiab qhov kub thiab txias, qhov kub thiab txias tuaj yeem khaws cia ntau li 50, 000 pawg.
5. Vim li cas thiaj xaiv Peb Tsis Siv Neeg SMD SMT LED BGA rework chaw nres tsheb?
6. Daim ntawv pov thawj ntawm BGA rework system computer kho tshuab
UL, E-MARK, CCC, FCC, CE ROHS daim ntawv pov thawj. Lub caij no, txhawm rau txhim kho thiab ua kom zoo dua qub, Dinghua tau dhau ISO, GMP, FCCA, C-TPAT ntawm qhov chaw soj ntsuam daim ntawv pov thawj.
7. Ntim & Kev xa khoom ntawm Tsis Siv Neeg BGA rework reballing tshuab
8. Kev xa khoom rau BGA rework chaw nres tsheb
DHL, TNT, FEDEX, SF, Kev thauj mus los hauv hiav txwv thiab lwm cov kab tshwj xeeb, thiab lwm yam .. Yog tias koj xav tau lwm lub sijhawm shipping, thov qhia rau peb. Peb yuav txhawb koj.
9. Cov nqe lus them nqi
Hloov chaw hauv txhab nyiaj, Western Union, Credit Card.Thov qhia rau peb yog tias koj xav tau lwm yam kev txhawb nqa.
10. Cov kev paub txog rau aUtomatic reballing infrared BGA kho tshuab
Siv BGA rework chaw nres tsheb tuaj yeem muab faib ua peb kauj ruam: desoldering, tso, thiab soldering. Hauv qab no, peb coj BGA rework chaw nres tsheb DH-A2 ua piv txwv:
Desoldering:
1, Kev Npaj Kho:Txiav txim siab cov cua nozzle siv rau BGA nti raug kho. Lub rework kub yog teem raws li seb cov hlau lead los yog lead-free solder yog siv los ntawm cov neeg muas zaub, raws li lub melting point ntawm leaded solder npas yog feem ntau 183 degree, thaum lub melting point ntawm lead-free solder balls yog nyob ib ncig ntawm 217 degree. Txhim kho PCB motherboard ntawm BGA rework platform thiab kho qhov chaw liab laser ntawm qhov chaw ntawm BGA nti. Txo lub taub hau qhov chaw tso cai los txiav txim qhov qhov siab qhov chaw qhov tseeb.
2, Teem lub Desoldering Kub:Khaws qhov kub thiab txias kom nws tuaj yeem rov qab kho dua yav tom ntej. Feem ntau, qhov kub rau desoldering thiab soldering tuaj yeem raug teeb tsa rau tib tus nqi.
3, Pib Desoldering:Hloov mus rau hom disassembly ntawm lub vijtsam kov interface thiab nyem lub pob kho. Lub taub hau cua sov yuav cia li txo qis kom sov BGA nti.
4, Ua tiav:Tsib vib nas this ua ntej lub voj voog kub yuav xaus, lub tshuab yuav suab lub tswb. Thaum qhov ntsuas kub ua tiav, lub nozzle yuav cia li khaws BGA nti, thiab lub taub hau tso kawm yuav nqa BGA mus rau qhov chaw pib. Tus neeg teb xov tooj tuaj yeem txuas BGA nti mus rau lub thawv khoom. Desoldering tam sim no ua tiav.
Qhov chaw thiab Soldering:
1, Kev Npaj Qhov Chaw:Tom qab tshem tawm cov tin los ntawm lub ncoo ua tiav, siv BGA nti tshiab lossis ib lub pob BGA nti. Txhim kho PCB motherboard thiab kwv yees li qhov chaw BGA ntawm lub ncoo.
2, Pib Qhov Chaw:Hloov mus rau hom kev tso kawm, nyem lub pob pib, thiab lub taub hau qhov chaw yuav txav mus. Lub nozzle yuav cia li khaws BGA nti thiab txav mus rau qhov chaw pib.
3, Optical Alignment:Qhib lub lens kho qhov muag, kho lub micrometer, thiab kho cov PCB ntawm X thiab Y axes. Kho lub BGA lub kaum sab xis nrog R lub kaum sab xis. Cov pob qij txha (tshwj xeeb hauv xiav) ntawm BGA thiab cov pob qij txha sib txuas (tso xim daj) ntawm lub ncoo tuaj yeem pom hauv cov xim sib txawv ntawm cov zaub. Tom qab kho kom cov pob qij txha thiab cov pob qij txha sib tshooj tag nrho, nyem lub pob "Alignment Complete" ntawm lub vijtsam kov.
4, Ua tiav:Lub taub hau kev tso kawm yuav cia li txo qis, tso BGA ntawm lub ncoo, thiab tua lub tshuab nqus tsev. Lub taub hau yuav nce li ntawm 2-3mm thiab pib cua sov. Thaum qhov ntsuas kub nkhaus tiav lawm, lub taub hau cua sov yuav nce mus rau qhov chaw pib. Soldering tiav.
Soldering:
Qhov no muaj nuj nqi yog siv rau BGAs uas tsis zoo soldered vim tsis kub thiab yuav tsum tau reheating.
1, Kev Npaj:Txhim kho PCB board ntawm lub rework platform thiab tso lub laser liab dot ntawm qhov chaw ntawm BGA nti.
2, Pib Soldering:Teem qhov kub, hloov mus rau vuam hom, thiab nias pib. Lub taub hau cua sov yuav cia li qis dua. Tom qab hu rau BGA nti, nws yuav nce los ntawm 2-3 hli thiab mam li pib cua sov.
3, Ua tiav:Tom qab qhov ntsuas kub nkhaus ua tiav, lub taub hau cua sov yuav cia li nce mus rau qhov chaw pib. Soldering tam sim no ua tiav.
