BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

DH-A2E BGA Rework chaw nres tsheb. Tag nrho tsis siv neeg Rework systems rau SMD li: BGA, nws yog xim hlau BGA, CGA, BGA qhov (socket), QFP, PLCC, MLF thiab cov khoom ntawm nqes mus rau 1x1 hli. Tiv tauj peb thiab tau txais tus nqi zoo tshaj.

Xa kev nug

Hauj lwm lawm

BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System yog hom khoom siv hluav taws xob tsim khoom siv rau kev rov ua haujlwm

Ball Grid Array (BGA) Cheebtsam. Nws yog ib tug tag nrho automated system uas feem ntau muaj xws li nta xws li automated

Kev tshem tawm cov khoom siv, kev pom kev raws li kev sib raug zoo, reflow cua sov, thiab cua txias. Lub system yog tsim los streamline qhov

rework txheej txheem, txhim kho qhov tseeb thiab sib xws, thiab nce kev ua haujlwm hauv kev tsim hluav taws xob.

BGA Reballing Machine Product imga2

Qauv: DH-A2E

1.Khoom nta ntawm Cua KubBGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

selective soldering machine.jpg

Kev ua tiav siab ntawm kev kho chip-theem. Desoldering, mounting thiab soldering txheej txheem yog tsis siv neeg.
Yooj yim sib dhos.
Peb tus kheej kub cua sov + PID tus kheej-tsim kho, qhov tseeb kub yuav nyob ntawm ± 1 degree
Built-in lub tshuab nqus tsev twj, khaws thiab tso BGA chips.
Tsis siv neeg txias ua haujlwm.

2.Specification ntawm Infrared BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

Hwj chim	5300w
Lub tshuab cua sov sab saum toj	Cua kub 1200w
Hauv qab rhaub	Cua kub 1200W. Infrared 2700w
Fais fab mov	AC220V ± 10% 50/60Hz
Dimension	L530 * W670 * H790 hli
Qhov chaw	V-groove PCB kev txhawb nqa, thiab nrog rau sab nraud universal fixture
Kev tswj qhov kub thiab txias	Ktype thermocouple, kaw voj tswj, ywj siab cua sov
Kub qhov tseeb	± 2 degree
PCB loj	Max 450 * 490 mm, Min 22 * 22 mm
Workbench fine-tuning	± 15mm rau pem hauv ntej / rov qab, ± 15mm sab xis / sab laug
BGA chip	80 * 80-1 * 1 hli
Yam tsawg kawg ntawm nti sib nrug	0.15 hli
Temp Sensor	1 (yeem)
Net nyhav	70kg ua

3.Cov ntsiab lus ntawm Laser positioning BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

A2E细节图-背景1-玻璃 A2E细节图-背景2-玻璃 automatic soldering machine.jpg

4. Vim li cas thiaj xaiv peb txoj haujlwm laserBGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System?

mini wave soldering machine.jpg soldering machine price.jpg

5.Certificate of Optical alignment BGA Station Full Automatic Rework System

BGA Reballing Machine

6. Cov npe ntim khoomntawm Optics dlhos CCD Lub Koob Yees DuabBGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System

BGA Reballing Machine

7. Kev xa khoom ntawm BGA Chaw Nres Tsheb Tag Nrho Tsis Siv Neeg Rework System Split Vision

Peb xa lub tshuab ntawm DHL / TNT / UPS / FEDEX, uas yog ceev thiab nyab xeeb. Yog tias koj xav tau lwm cov nqe lus ntawm kev xa khoom,

thov koj xav qhia rau peb paub.

8. Tiv tauj peb rau kev teb tam sim thiab tus nqi zoo tshaj.

Email: john@dinghua-bga.com

MOB/WhatsApp/Wechat: +8615768114827

Nyem qhov txuas ntxiv kuv WhatsApp:

https://api.whatsapp.com/send?phone=8615768114827

9. Cov xov xwm ntsig txog qhov tsis siv neeg BGA Chaw Nres Nkoj Tag Nrho Tsis Siv Neeg Rework System Tshuab

Semiconductors thiab Cov Khoom Siv Hluav Taws Xob: Cov Khoom Muag Khoom Muag tau nce ntau xyoo dhau ib xyoos.
Tus nqi ntawm FPC (Flexible Printed Circuit) thiab SLP (Substrate-Like PCB) tau nce hauv 5G era.

Apple's softboard manufacturers pom qhov nce 31% hauv lub Peb Hlis, thaum Taiwan cov tuam txhab hardboard tau ntsib qhov nce 6% xyoo-rau-xyoo.
Vim yog lub hauv paus qis nyob rau lub Peb Hlis 2023 thiab qhov cuam tshuam ntawm Lub Caij Nplooj Ntoos Hlav Caij Nplooj Ntoos Hlav thaum Lub Ob Hlis, Apple cov tuam txhab muag muag cov nyiaj tau los tau nce 31% hauv lub Peb Hlis. Qhov no kuj tau txais kev txhawb nqa los ntawm kev hloov pauv hauv kev ua haujlwm, ua rau 61% cov nyiaj tau los ntawm lub hli dhau los. Ntawm lawv, Harding qhov kev ua tau zoo tshwj xeeb, nrog rau 33% cov nyiaj tau los ntawm lub xyoo nce thiab 59% kev loj hlob ntawm peb lub hlis twg. Ntawm sab hardboard, vim qhov kev xav tau qis qis qis, cov neeg siv khoom tau hloov kho thiab txo qis cov khoom muag. Taiwan cov tuam txhab hardboard pom tau nce 6% hauv lub Peb Hlis, nrog rau 21% nce piv rau tib lub sijhawm xyoo tas los.

FPC: Tus kav hlau txais xov suav, Cov kab sib kis, tus nqi nkag, thiab ASP Tag Nrho Cov Ncej
Hauv 5G era, tus kav hlau txais xov array tau hloov kho los ntawm MIMO (Multiple Input Multiple Output) thev naus laus zis mus rau Massive MIMO thev naus laus zis. Qhov kev hloov kho tshiab no tau nce ntau ntawm cov kav hlau txais xov ntawm txhua lub cuab yeej, uas ua rau nce tus naj npawb ntawm RF (xov tooj cua zaus) cov kab sib kis. Cov kev xav tau sib koom ua ke siab ntawm 5G kuj tau tsav FPC los hloov cov kav hlau txais xov ib txwm thiab RF kis kab. Kev nkag mus ntawm FPC hauv Android cov khoom siv yuav tsum nce siab. Tsoos PI (Polyimide) cov laug cam tsis txaus los ua kom tau raws li qhov kev xav tau siab, siab ceev ntawm 5G era. FPCs ua los ntawm MPI (Modified Polyimide) thiab LCP (Liquid Crystal Polymer) cov ntaub ntawv yuav maj mam hloov cov PI tsoos. Piv nrog rau PI ib txwm muaj, MPI thiab LCP muaj cov txheej txheem tsim khoom ntau dua, cov khoom lag luam qis dua, thiab cov neeg muag khoom tsawg dua, tab sis lawv cov ASP (Nqi Muag Khoom Nruab Nrab) yog ntau dua.

PCB: Qhov chaw muaj rau PCBs nyob rau hauv 5G Era yog qhov txo qis, thaum SLP nkag mus tau xav tias yuav nce
Txij li xyoo 2017, motherboards tau txais ob SLPs (ob txheej ntawm SLP thiab ib HDI (High-Density Interconnector) board) los txuas cov chips, txo qhov ntim rau 70% ntawm nws qhov loj me. Raws li tus naj npawb ntawm RF channel nce nyob rau hauv 5G era, tus naj npawb ntawm RF pem hauv ntej-kawg thiab cov ntaub ntawv yuav nce siab, ua kom muaj nuj nqi thiab roj teeb ntim vim muaj cov ntxaij vab tshaus loj. Qhov no ua rau kom nruj dua PCB qhov chaw. Tus SLP nkag mus tau yog xav tias yuav nce ntxiv thiab tau txais los ntawm Android camp. Tus nqi ntawm high-end ib leeg-chip SLPs siv M-SAP (Modified Semi-Automated Process) yog ntau tshaj ob npaug ntawm ib txwm siv Anylayer technology, nqa ntau tus nqi rau lub xov tooj ntawm tes PCBs.

Cov lus qhia txog kev nqis peev
Peb ntseeg tias PCB kev lag luam saw yuav tau txais txiaj ntsig zoo los ntawm qhov kev thov uas tau tsav los ntawm 5G terminals. Peb pom zoo kom them nyiaj rau PCB cov tuam txhab thiab cov tuam txhab muaj feem cuam tshuam txog cov khoom siv. Cov tuam txhab tsim nyog hauv cov saw hlau muaj xws li FPC thiab SLP chaw tsim khoom Dongshan Precision (002384), Pending Holdings, Jingwang Electronics, Hongxin Electronics, thiab FPC electromagnetic shielding film chaw tsim tshuaj paus Lekai New Materials (300446).

Yam Tseem Ceeb
Muaj kev pheej hmoo ntawm kev poob qis hauv kev muag khoom smartphone; 5G kev lag luam xa tawm tuaj yeem poob qis ntawm kev cia siab; kev lag luam tuaj yeem ntsib kev poob qis; Kev tsim khoom tshiab tuaj yeem ua tiav qeeb dua li qhov xav tau; muaj kev pheej hmoo ntawm cov khoom lag luam poob qis; Kev nkag mus rau thev naus laus zis tshiab yuav qeeb dua li qhov xav tau; thiab cov khoom lag luam txais yuav tsawg dua li qhov xav tau.